Amkor Technology, Inc.

Amkor Technology, Inc. is a leading US-headquartered service company specializing in outsourced semiconductor packaging and test services. Founded in 1968 and based in Tempe, Arizona, Amkor is recognized as a global leader in the OSAT market. With over 10,000 employees and reported revenues of $6.3 billion in 2024, the company operates 12 factory locations globally across China, Japan, Korea, Malaysia, Philippines, Portugal, Taiwan, and Vietnam. Amkor offers a comprehensive portfolio of solutions including advanced packaging, wafer-level processing, and system-in-package solutions. Their product lines encompass Antenna in Package (AiP)/Antenna on Package (AoP), FCBGA, fcCSP, Laminate Packaging, Leadframe Packaging, Memory & Storage Packaging, MEMS & Sensors Packaging, Power Packaging, SiP Packaging, and Wafer Level Packaging. They also provide services such as IC Test, Wafer Bumping, 3D Packaging, Flip Chip, and Package-on-Package. These solutions support critical applications in smartphones, data centers, AI, automotive, and IoT. Amkor is committed to innovation, investing significantly in R&D and new facilities, including a $2 billion factory in Arizona for advanced packaging, and aims for net-zero emissions by 2050.