F & K DELVOTEC BONDTECHNIK GMBH

F & K DELVOTEC BONDTECHNIK GMBH, established in 1978 and headquartered in Ottobrunn, Germany, is a globally operating manufacturer and service provider specializing in innovative joining technology. As a technology leader in wire bonding, the company focuses on research and development, collaborating with leading companies and research institutes. They offer a comprehensive range of ultrasonic and laser bonding solutions and machines, including ultrasonic thin wire, ball-wedge, heavy wire, and heavy ribbon bonders, as well as laser bonding solutions for various materials. Their product portfolio serves diverse industries such as MEMS, sensors, optoelectronics, power devices, automotive, and battery production, providing solutions for semiconductor assembly equipment and microelectronics manufacturing. F & K DELVOTEC BONDTECHNIK GMBH provides both stand-alone machines and fully integrated automatic production lines, along with services like automation, training through their "Bond Academy," and process optimization. With 51 to 100 employees and manufacturing facilities in Germany, the USA, Singapore, and China, the company holds ISO 9001 certification and numerous patents, demonstrating its commitment to quality and innovation. They are part of the STRAMAGROUP, leveraging synergies for automation expertise, particularly in e-mobility.